X-Ray Inspection Services
Advanced X-Ray Inspection for Hidden Solder Joint Verification and Internal PCB Assembly Inspection
Non-destructive X-Ray inspection for BGA, QFN, and other assemblies with hidden solder joints and internal features.
BGA • QFN • Hidden Solder Joints • Non-Destructive
3000㎡+
30+
ISO 9001
24 Hours
Professional X-Ray Inspection Services
VoltCircuits uses digital X-Ray inspection systems to examine hidden solder joints and internal PCB assembly features that cannot be adequately inspected through visual inspection or AOI. X-Ray inspection provides non-destructive verification for complex and high-density PCB assemblies.
Hidden Solder Joint Inspection
Inspect solder connections beneath components such as BGA packages where the joints are not visible from the PCB surface.
Non-Destructive Inspection
Examine internal assembly features without physically opening or damaging the PCB assembly.
Support for Complex Assemblies
X-Ray inspection provides additional inspection capability for high-density and complex PCB assemblies where optical inspection alone may not be sufficient.
What Is X-Ray Inspection?
X-Ray Inspection is a non-destructive testing (NDT) method that uses X-Ray imaging to inspect internal solder joints and hidden assembly features without damaging the PCB assembly.
Inspect Hidden Connections
X-Ray allows engineers to examine solder joints and internal features that cannot be adequately evaluated through visual or optical inspection.
Suitable for Hidden-Lead Packages
X-Ray inspection is particularly useful for packages such as BGA, QFN, CSP, and LGA, where critical solder connections may be hidden beneath or within the component package.
Non-Destructive Verification
The assembly can be inspected without removing components or physically opening the PCB, making X-Ray suitable for production quality control.
VISIBLE INSPECTION → X-RAY → HIDDEN FEATURES
Why X-Ray Inspection Matters
X-Ray inspection provides non-destructive visibility into hidden solder joints and internal assembly features, helping identify defects that may not be detectable through visual or optical inspection alone.
Detect Hidden Assembly Defects
Identify hidden soldering and internal assembly issues that cannot be adequately evaluated through visual inspection.
Verify Critical Solder Joints
Examine hidden solder connections on BGA, CSP, QFN, LGA, and other packages where joints are not directly visible.
Reduce Defect Escape Risk
Early identification of hidden assembly defects can help reduce the risk of defective assemblies progressing through production.
Support Production Yield
Finding hidden soldering issues during production can help reduce rework and support more consistent manufacturing results.
Support Product Reliability
Identifying hidden assembly defects helps support overall PCB assembly quality and reduce the risk of latent manufacturing issues.
Support Quality Requirements
X-Ray inspection can be incorporated into project-specific quality-control plans and inspection requirements for complex or high-reliability assemblies.
What Is X-Ray Inspection?
X-Ray Inspection is a non-destructive testing (NDT) method that uses X-Ray imaging to inspect internal solder joints and hidden assembly features without damaging the PCB assembly.
BGA Solder Bridges
Identify unintended solder connections between adjacent BGA solder balls where the geometry and imaging conditions allow detection.
Open Solder Joints
Detect solder connections that appear incomplete or missing beneath components.
Soldering Irregularities
Identify certain soldering conditions, including insufficient or excessive solder, based on defined inspection criteria.
Voids in Solder Balls
Detect voids or internal air pockets within solder connections that may affect the solder joint’s structure or thermal performance.
Head-in-Pillow Defects
Help identify head-in-pillow conditions where a BGA solder ball and the corresponding solder paste deposit do not form a proper metallurgical connection.
Missing Solder Balls
Detect missing or abnormal BGA solder balls where they are visible in the X-Ray image.
COMPONENT ALIGNMENT
Misaligned Components
Identify certain component-placement or solder-joint alignment issues visible in the X-Ray image.
INTERNAL ASSEMBLY CONDITIONS
Internal Assembly Conditions
Examine selected internal PCB assembly features that cannot be adequately evaluated through surface inspection.
Components & Assemblies We Inspect
X-Ray inspection is particularly useful for PCB assemblies with hidden solder joints, fine-pitch packages, and internal structures that cannot be adequately evaluated through optical inspection alone.
BGA Packages
Inspect hidden BGA solder connections, including solder-ball formation, alignment, and selected internal soldering conditions.
Micro BGA
Examine closely spaced solder connections on micro-BGA packages where optical access is limited.
CSP (Chip Scale Package)
Inspect hidden solder connections on compact chip-scale packages.
QFN Components
Examine hidden perimeter and exposed-pad solder connections where visual access may be limited.
LGA Components
Inspect hidden contacts and solder connections beneath LGA packages.
PoP (Package-on-Package)
Examine hidden solder connections within stacked package assemblies.
High-Density PCB Assemblies
Provide additional inspection capability for densely populated assemblies with limited optical access.
Multi-Layer PCB Assemblies
Support inspection of selected internal assembly features within complex multilayer PCB assemblies.
What Is X-Ray Inspection?
X-Ray Inspection is a non-destructive testing (NDT) method that uses X-Ray imaging to inspect internal solder joints and hidden assembly features without damaging the PCB assembly.
PCB Assembly Completed
The assembled PCB is prepared for X-Ray inspection according to the project’s inspection requirements.
Step 1
X-Ray
Image Acquisition
High-resolution X-Ray images are captured to visualize hidden solder joints and internal assembly features.
Step 2
High-Resolution Image Analysis
The captured images are analyzed to evaluate solder connections, component alignment, voids, and other relevant internal features.
Step 3
Defect
Identification
Potential defects or abnormal conditions are identified according to defined inspection criteria.
Step 4
Engineering
Review
Quality or engineering personnel review inspection findings and verify potential defects before corrective action.
Step 5
Corrective Action When Required
Confirmed issues are addressed through appropriate rework or process correction according to project requirements.
Step 6
Inspection Result Review & Release
Inspection results are reviewed and the assembly proceeds to the next production or quality-control stage.
Step 7
Advanced X-Ray Inspection Equipment
VoltCircuits uses digital X-Ray inspection systems to visualize hidden solder joints and internal assembly features, supporting detailed inspection of complex PCB assemblies.
Digital X-Ray Inspection Systems
Digital X-Ray systems provide non-destructive imaging of hidden solder joints and internal PCB assembly features.
High-Resolution X-Ray Imaging
High-resolution imaging helps engineers evaluate small solder joints, voids, component alignment, and other internal features.
Multiple Viewing Angles
Multiple viewing angles provide additional perspectives when evaluating complex components and hidden solder connections.
X-Ray Image Analysis
Inspection software and engineering review help identify and evaluate potential defects in captured X-Ray images.
Internal Structure Inspection
X-Ray imaging provides visibility into selected internal assembly features that cannot be adequately inspected optically.
Inspection Data & Traceability
Relevant inspection results can be recorded and associated with production information to support quality tracking and traceability.
What Is X-Ray Inspection?
X-Ray Inspection is a non-destructive testing (NDT) method that uses X-Ray imaging to inspect internal solder joints and hidden assembly features without damaging the PCB assembly.
MATERIAL CONTROL
Incoming Material Inspection
Verify incoming PCBs, components, and materials against project requirements before production.
PROCESS INSPECTION
SPI (Solder Paste Inspection)
Check solder paste deposition before component placement and reflow to help identify printing-related process issues.
AOI Inspection
Inspect visible component placement and soldering conditions using automated optical inspection.
X-Ray Inspection
Examine hidden solder joints and internal assembly features that cannot be adequately evaluated through optical inspection.
VALIDATION
Functional Testing
Verify assembled PCB functionality according to project-specific testing requirements.
First Article Inspection (FAI)
Review initial production assemblies to verify process setup and assembly requirements.
FINAL QUALITY
Final Quality Inspection
Verify PCB assembly functionality according to project-specific testing requirements.
Production Traceability
Maintain relevant material and production records to support quality tracking and traceability.
When Is X-Ray Inspection Used?
X-Ray inspection is particularly useful when PCB assemblies contain hidden solder joints, high component density, or internal features that cannot be adequately evaluated through visual or optical inspection.
TECHNICAL REQUIREMENTS
BGA PCB Assembly
X-Ray inspection is commonly used to examine hidden BGA solder joints that cannot be visually inspected after assembly.
Fine-Pitch & High-Density Assemblies
Additional X-Ray inspection can help evaluate assemblies where closely spaced components and hidden connections make optical inspection more limited.
Complex PCB Assemblies
Useful for assemblies with multiple hidden connections, stacked packages, or other internal features requiring additional inspection visibility.
APPLICATIONS
Medical Electronics
X-Ray inspection can support quality-control requirements for PCB assemblies used in medical and healthcare equipment.
Automotive Electronics
Suitable for automotive electronic assemblies where hidden solder-joint verification may be required by the product or quality requirements.
Industrial Control Systems
Useful for complex industrial control assemblies requiring additional inspection of hidden solder connections.
Telecommunications Equipment
Supports inspection of dense communication and networking assemblies with hidden or closely spaced connections.
High-Reliability Applications
X-Ray inspection can be incorporated into quality-control plans for applications where hidden assembly defects require additional verification.
Why Choose VoltCircuits for X-Ray Inspection?
VoltCircuits combines advanced X-Ray inspection, engineering review, and structured quality control to support reliable PCB assembly inspection from prototype through production.
Advanced X-Ray Inspection Equipment
Digital X-Ray inspection systems provide non-destructive imaging of hidden solder joints and internal assembly features.
Experienced Quality Engineers
Quality and engineering personnel review inspection results and help evaluate potential defects.
Strict Inspection Standards
Inspection criteria are defined according to project requirements and applicable production specifications.
Prototype to Mass Production
X-Ray inspection support is available across prototype, low-volume, and larger-scale PCB assembly production.
Engineering Review & Support
Engineering support helps review inspection requirements and address manufacturing issues identified during production.
Integrated Quality Control
X-Ray inspection works alongside AOI, SPI, functional testing, first article inspection, and final quality inspection when required.
Global B2B Manufacturing Support
VoltCircuits supports overseas customers with engineering communication, production coordination, and worldwide delivery.
Dedicated Project Management
A dedicated project contact helps coordinate technical requirements, production progress, quality communication, and delivery.
Benefits for Your Project
X-Ray inspection provides additional visibility into hidden solder connections and internal assembly features, helping identify potential defects before they progress further through production.
Verify Hidden Solder Connections
Inspect solder joints beneath BGA, CSP, QFN, LGA, and other components where direct visual inspection is limited.
Reduce Manufacturing Risk
Identify hidden assembly issues earlier and reduce the risk of defects progressing through subsequent production stages.
Support First Pass Yield
Early identification of hidden soldering issues can help reduce avoidable rework and support more consistent first-pass production results.
Support Product Reliability
Detect certain hidden assembly conditions that could otherwise contribute to latent manufacturing issues.
Reduce Rework & Quality Costs
Finding defects during production can help reduce unnecessary rework, scrap, and downstream quality-related costs.
Improve Production Consistency
Combine X-Ray inspection with other quality-control methods to support consistent PCB assembly quality.
Industries We Serve
X-Ray inspection supports PCB assembly quality control across industries where hidden solder joints, dense assemblies, and internal connections require additional inspection.
Industrial Electronics
PCB assemblies for industrial control, automation, instrumentation, and equipment.
Automotive Electronics
Electronic assemblies requiring additional inspection of hidden solder connections and complex packages.
Medical Devices
PCB assemblies where project-specific quality requirements call for additional internal inspection.
IoT Devices
Compact, high-density assemblies with closely spaced components and hidden connections.
Consumer Electronics
Dense electronic assemblies requiring additional verification of hidden solder joints.
Telecommunications
High-density communication and networking assemblies with complex component connections.
AI Computing Hardware
High-density computing and processing assemblies using advanced packages and complex PCB layouts.
Power Electronics
Assemblies containing larger components and power-related solder connections where additional inspection may be required.
Related PCB Assembly Capabilities
X-Ray inspection works alongside VoltCircuits’ PCB assembly and testing capabilities to provide a complete quality-control approach for complex electronic assemblies.
SMT Assembly
Precision surface-mount assembly for components ranging from standard packages to high-density devices.
Through-Hole Assembly
Reliable through-hole assembly for connectors, power components, and mechanically demanding applications.
BGA Assembly
High-precision BGA assembly with X-Ray inspection for hidden solder-joint verification.
AOI Inspection
Automated optical inspection for visible component placement and soldering defects.
Functional Testing
Project-specific testing to verify assembled PCB functionality and performance.
First Article Inspection
Initial production inspection to verify assembly quality and manufacturing requirements.
Frequently Asked Questions About X-Ray Inspection
What is X-Ray Inspection?
X-Ray inspection uses non-destructive imaging to examine hidden solder joints and internal PCB assembly features.
Why Is X-Ray Inspection Necessary for BGA Assemblies?
BGA solder joints are hidden beneath the package and cannot be fully inspected visually or by AOI.
Can X-Ray Detect Hidden Solder Joint Defects?
Yes. X-Ray can help identify issues such as voids, bridges, missing solder, and other hidden defects.
What Types of PCB Assemblies Require X-Ray Inspection?
It is especially useful for BGA, CSP, QFN, LGA, PoP, and other high-density assemblies with hidden connections.
Does VoltCircuits Inspect Every BGA Assembly?
X-Ray inspection is applied according to project requirements, package type, quality requirements, and agreed inspection criteria.
How Does X-Ray Inspection Improve Product Reliability?
It provides visibility into hidden connections and helps identify defects that may not be detected by visual inspection or AOI.
What Is the Difference Between AOI and X-Ray Inspection?
AOI checks visible assembly features, while X-Ray examines hidden solder joints and internal structures.
Is X-Ray Inspection Non-Destructive?
Yes. X-Ray inspection examines internal features without physically damaging the PCB assembly.
Need High-Reliability PCB Assembly?
VoltCircuits combines advanced X-Ray inspection, experienced quality engineers, and strict quality management to support reliable PCB assembly from prototype to production.
- Advanced X-Ray
- Quality Engineering
- Strict Quality Control
READY TO START YOUR PROJECT?
Engineering Your Product
from Prototype to Production
Ready to move your electronics project forward? Work with VoltCircuits for reliable PCB and PCBA manufacturing from prototype to production.